A Study on Chemical and Mechanical Properties of NiCrSn Films for Flexible Copper Interconnect-Reference-Cited by-同舟云学术

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A Study on Chemical and Mechanical Properties of NiCrSn Films for Flexible Copper Interconnect

Published:2016-04-01 Issue:4 Volume:8 Page:866-871
ISSN:1947-2935
Container-title:Science of Advanced Materials
language:en
Short-container-title:sci adv mater

Author:

Park In-Sun,Kim Hongsik,Kim Byoung O.,Choe HeeHwan,Jeon Jae-Hong,Ahn Joongkyu,Kim Soo-Hyun,Seo Jong Hyun

Publisher

American Scientific Publishers

Subject

General Materials Science

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Determining Interfacial Shear Bond Strength in Thin Laminated Metal Composites;Science of Advanced Materials;2018-11-01

2. P-14: Prevention of Indium Segregation in BCE Type InGaZnO TFTs with Titanium Source/Drain;SID Symposium Digest of Technical Papers;2017-05

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