Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation-Reference-Cited by-同舟云学术

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Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation

Published:2003 Issue:4-2 Volume:119/120 Page:421-429
ISSN:0376-9429
Container-title:International Journal of Fracture
language:en
Short-container-title:International Journal of Fracture

Author:

Scherban T.,Pantuso D.,Sun B.,El-Mansy S.,Xu J.,Elizalde M.R.,Sánchez J.M.,Martínez-Esnaola J.M.

Publisher

Springer Science and Business Media LLC

Subject

Mechanics of Materials,Modelling and Simulation,Computational Mechanics

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mechanical Robustness of Patterned Structures and Failure Mechanisms;More-than-Moore Devices and Integration for Semiconductors;2023

2. Interfacial adhesion strength of III-N heterostructures;Materials & Design;2022-01

3. Deformation, failure and removal mechanisms of thin film structures in abrasive machining;Advances in Manufacturing;2017-02-18

4. Cross-sectional nanoindentation (CSN) studies on the effect of thickness on adhesion strength of thin films;Journal of Physics D: Applied Physics;2014-12-23

5. On the effects of thickness on adhesion of TiW diffusion barrier coatings in silicon integrated circuits;Surface and Coatings Technology;2014-11

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