Identification of Faulty BGA Solder Joints in X-Ray Images
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EJournal Publishing
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Void and solder joint detection for chip resistors based on X-ray images and deep neural networks;Microelectronics Reliability;2022-08
2. A Method for Automated Control of Electronic Components on Microfocus X-ray Images;Journal of the Russian Universities. Radioelectronics;2021-09-28
3. OVERVIEW OF THE USE OF X-RAY EQUIPMENT IN ELECTRONICS QUALITY TESTS;Informatyka, Automatyka, Pomiary w Gospodarce i Ochronie Środowiska;2021-06-30
4. Open Defect Detection in Assembled Circuit Boards With Built-In Relaxation Oscillators;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-06
5. Osteoarthritis detection by applying quadtree analysis to human joint knee X-ray imagery;International Journal of Computers and Applications;2020-11-03
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