Implication of low temperature and sonication on electrocrystallization mechanism of Cu thin films: a kinetics and structural correlation-Reference-Cited by-同舟云学术

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Implication of low temperature and sonication on electrocrystallization mechanism of Cu thin films: a kinetics and structural correlation

Published:2013-01-28 Issue:2 Volume:16 Page:539-545
ISSN:1980-5373
Container-title:Materials Research
language:
Short-container-title:Mat. Res.

Author:

Mallik Archana¹,Ray Bankim Chandra¹

Affiliation:

1. National Institute of Technology, India

Publisher

FapUNIFESP (SciELO)

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

http://www.scielo.br/pdf/mr/v16n2/aop_1310-12.pdf

Reference30 articles.

1. Matter at Low Temperatures;McClintock PVE,1984

2. High temperature electrochemistry: A review;Wildgoose GG;Electroanalysis,2004

3. Interparticle Collisions Driven by Ultrasound;Doktycz SJ;Science,1990

4. Use the power of sonocrystallization for improved properties;McCausland LJ;Chemical Engineering Progress,2001

5. Ultrasound and electroplating;Walker R;Chemistry in Britain.,1990

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