Effect of light-curing units and activation mode on polymerization shrinkage and shrinkage stress of composite resins
Author:
Affiliation:
1. Federal University of Goiás, Brazil
2. University of São Paulo, Brazil
Publisher
FapUNIFESP (SciELO)
Subject
General Dentistry
Link
http://www.scielo.br/pdf/jaos/v16n1/07.pdf
Reference38 articles.
1. Dynamic elastic modulus of "packable" composites;Abe Y;Dent Mater.,2001
2. Influence of composition on rate of polymerization contraction of light-curing resin composites;Asmussen E;Acta Odontol Scand.,2002
3. Effect of ramped light intensity on polymerization force and conversion in a photoactivated composite;Bouschlicher MR;J Esthet Dent.,2000
4. Shedding new light on composite polymerization;Caughman WF;Oper Dent.,2002
5. Comparison of post-gel shrinkage strains in light-polymerized composite resins;Cehreli MC;J Prosthet Dent.,2002
Cited by 27 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Characterization of experimental resin composites with cholesteryl methacrylate organic matrix – Part 2;Dental Materials;2024-08
2. Comparative Analysis of Coronal Sealing Materials in Endodontics: Exploring Non-Eugenol Zinc Oxide-Based versus Glass-Ionomer Cement Systems;European Journal of Dentistry;2024-06-28
3. Toward Optimum Light Curing of Resin Composite Restorations: A survey on Current Awareness and Practice among General Dentists in Saudi Arabia;The Open Dentistry Journal;2023-04-10
4. Evaluation of Microleakage of a New Bioactive Material for Restoration of Posterior Teeth: An In Vitro Radioactive Model;Applied Sciences;2022-11-21
5. Photoelasticity for Stress Concentration Analysis in Dentistry and Medicine;Materials;2022-09-30
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3