Transient Unidirectional Solidification, Microstructure and Intermetallics in Sn-Ni Alloys-Reference-Cited by-同舟云学术

Transient Unidirectional Solidification, Microstructure and Intermetallics in Sn-Ni Alloys

Published:2018 Issue:suppl 1 Volume:21 Page:
ISSN:1980-5373
Container-title:Materials Research
language:
Short-container-title:Mat. Res.

Author:

Cruz Clarissa Barros da¹,Kakitani Rafael¹,Xavierb Marcella Gautê Cavalcante²,Silva Bismarck Luiz³^ORCID,Garcia Amauri¹,Cheung Noé¹,Spinelli José Eduardo²^ORCID

Affiliation:

1. Universidade de Campinas - UNICAMP, Brasil

2. Universidade Federal de São Carlos - UFSCar, Brasil

3. Universidade Federal do Rio Grande do Norte - UFRN, Brasil

Publisher

FapUNIFESP (SciELO)

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

http://www.scielo.br/pdf/mr/v21s1/1516-1439-mr-1980-5373-MR-2017-1099.pdf

Reference35 articles.

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3. Influence of bismuth on the solidification of Sn-0. 7Cu-0.05Ni-xBi/Cu joints;Belyakov SA;Journal of Alloys and Compounds,2017

4. Dependency of eutectic spacings and microhardness on the temperature gradient for directionally solidified Sn-Ag-Cu lead-free solder;Böyük U;Materials Chemistry and Physics,2010

5. Combined effects of Ag content and cooling rate on microstructure and mechanical behavior of Sn-Ag-Cu solders;Pereira PD;Materials & Design,2013

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1. Role of Zn in the Microstructure, Segregation, and Cytotoxicity of Sn-0.2 Ni Solders;ACS Omega;2024-02-16

2. The Impacts of Co and Ni Additions to High Solute Content Fe-Contaminated Al alloys in Beneficing Microstructure and Tensile Properties;Materials Research;2024

3. Heat-flow parameters affecting microstructure and mechanical properties of Al–Cu and Al–Ni alloys in directional solidification: an experimental comparative study;International Journal of Materials Research;2022-02-22

4. Plate-like growth in a eutectic Bi–Ni alloy: effects of morphological microstructure evolution and Bi3Ni intermetallic phase on tensile properties;Journal of Materials Research and Technology;2020-05

5. Effect of Microstructure Features on the Corrosion Behavior of the Sn-2.1 wt%Mg Solder Alloy;Electronic Materials Letters;2020-01-22