Simulation study of thermomechanical fatigue of quilt packaging interchip interconnects
Author:
Publisher
MedCrave Group, LLC
Subject
Management Science and Operations Research,Mechanical Engineering,Energy Engineering and Power Technology
Reference13 articles.
1. Quilt Packaging: High-Density, High-Speed Interchip Communications;Bernstein;IEEE Transactions on Advanced Packaging,2007
2. Liu Q, Fay P, Bernstein GH. A Novel Scheme for Wide Bandwidth Chip–to–Chip Communications. International Microelectronics and Packaging Society. 2007. 4(1).
3. Quilt Packaging is a trademark of Indiana Integrated Circuits, LLC.
4. Ultra-wide Bandwidth Inter-Chip Interconnects for Heterogeneous Millimeter-Wave and THz Circuits;Fay;Journal of Infrared Millimeter and Terahertz Waves,2016
5. Khan MA, Kriman AM, Bernstein GH. Thermal Modeling of Quilt Packaging Interconnects. Micro/Nano Symposium (UGIM), 2010 18th Biennial University/Government/Industry. 2010.
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