Author:
Fay Patrick,Bernstein Gary H.,Lu Tian,Kulick Jason M.
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Instrumentation,Radiation
Reference14 articles.
1. P. Siegel, “Terahertz technology,” IEEE Trans. Microwave Theory and Techniques, vol. 50, pp. 910–928, 2002.
2. L. Yujiri, M. Shoucri, and P. Moffa, “Passive millimeter-wave imaging,” IEEE Microwave Mag., vol. 4, no. 3, pp. 39–50, Sep. 2003.
3. M. Kemp, “A review of millimeter wave and terahertz technology for detection of concealed threats,” in Proc. 33rd Int. Conf. infrared, Millimeter and Teraherzt Waves, pp. 1–2, Paper R5D2.1772, Sep. 2008.
4. G. H. Bernstein, Q. Liu, M. Yan, Z. Sun, D. Kopp, W. Porod, G. Snider, and P. Fay, “Quilt Packaging: High-Density, High-Speed Interchip Communications,” IEEE Trans. Advanced Packaging, vol. 30, no. 4, pp. 731–400, 2007.
5. G. H. Bernstein, Q. Liu, Z. Sun, and P. Fay, “Quilt packaging: A new paradigm for system-in-package,” in Proc. IEEE 7th Electron. Packag. Technol. Conf. (EPTC’05), p. 1–6, 2005.
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