Metallo-Organic Decomposition (MOD) Films for Electronic Packaging-Reference-Cited by-同舟云学术

Metallo-Organic Decomposition (MOD) Films for Electronic Packaging

Published:1986 Issue: Volume:72 Page:
ISSN:0272-9172
Container-title:MRS Proceedings
language:en
Short-container-title:MRS Proc.

Author:

Vest Geraldine M.,Cone V. P.,Herzfeld C. J.,Bhansali A. K.

Abstract

AbstractA metallo-organic decomposition (MOD) film is one formed by thermal decomposition of a solution containing one or more metallo-organic compounds that were deposited onto a substrate. This process yields metal, glasses, or polycrystalline ceramic films directly without passing through the powder stage. Conductor films studied include a screen printable gold and a screen printable and ink jet printable silver. Dielectric films studied include a low K lead borosilicate glass and a variety of ferroelectric compositions.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference11 articles.

1. Ink Jet Printing of Hybrid Circuits;Vest;Int. J. Hybrid Microelectronics,1983

2. A Generic Gold Conductor from Metallo-Organic Compounds;Vest;Intl. J. Hybird Microelectronics,1982

3. 10. Sabo C.J. , Vest G.M. , Singaram S. and Mis D. , “Silver Thick Film Metallization for photovoltaics fired at 300°C”, Proceedings of the International Society for Hybrid Microelectronics Symposium, Nov. 11–14, 1985, Anaheim, CA.

4. 7. Cone V.P. , “The Effect of Bismuth Concentration on the Adhesion of Gold Conductors Produced from Metallo-Organic Compounds on Alumina”. M.S. Dissertation Purdue University, Dec. 1982.

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