A Review on Materials and Technologies for Organic Large‐Area Electronics
Author:
Affiliation:
1. DTx – Digital Transformation CoLAB University of Minho Campus Azurém, Building 1 Guimarães 4800‐058 Portugal
2. IPC/i3N – Institute for Polymers and Composites University of Minho Campus de Azurém Guimarães 4800‐058 Portugal
Funder
European Social Fund
Publisher
Wiley
Subject
Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/admt.202001016
Reference440 articles.
1. The Through-Hole Plating of Printed Circuits
2. C.Ducas US1563731A 1925.
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