Abstract
The overwhelming majority of studies in microelectronics and fiber-optics are experimental. Not too many apply numerical, mainly finite-element, methods to analyze microelectronic and fiberoptic structures. There is a very small number of papers using analytical modeling. At the same time application of powerful and well-developed analytical methods of Engineering Mechanics often enables one to obtain valuable prior information of the mechanical behavior of materials and structures, interpret empirical data, and to extrapolate the accumulated experience on new designs [1,2]. As a rule, application of analytical modeling results in better understanding of the behavior and performance of a material or structure, and in substantial savings of time and expense. This review, based primarily on the author's research, addresses several basic and practically important problems related to the mechanical behavior of materials and-rational structural design of microelectronic and fiber-optic systems and lending themselves to sufficiently simple analytical solutions.
Publisher
Springer Science and Business Media LLC
Cited by
5 articles.
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1. On a paradoxical situation related to lap shear joints: could transverse grooves in the adherends reduce the interfacial stresses?;Journal of Physics D: Applied Physics;2008-05-08
2. Modeling of Thermal Stress in Microelectronic and Photonic Structures: Role, Attributes, Challenges, and Brief Review;Journal of Electronic Packaging;2003-06-01
3. Accelerated Life Testing (ALT) in Microelectronics and Photonics: Its Role, Attributes, Challenges, Pitfalls, and Interaction With Qualification Tests1;Journal of Electronic Packaging;2002-07-26
4. How to Make a Device into a Product: Accelerated Life Testing (ALT), Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests;Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
5. Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- and Opto-Electronic Systems: Role, Attributes, Challenges, Results;Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging