Formation of Sic Films on Silicon Field Emitters

Abstract

ABSTRACTThin films of silicon carbide have been formed on silicon field emitters by chemical reaction with ethylene (C2H4) at temperatures of 850 to 950°C using ethylene gas pressures up to 5×10-3 Torr. By controlling the reaction time and temperature, we have made SiC coatings of from ∼20 A thickness to complete transformation of tips to SiC (1-2 μm). The electron diffraction pattern of the SiC layers show the expected 20% lattice mismatch with silicon and, for those emitters completely transformed, a polycrystalline 3C-SiC polytype was identified. The small radius of curvature was maintained for both the coated and completely transformed tips, although some defects and surface roughness was introduced during the treatments.