Calculation of Stress Gradients in Thin Al-0.5%Cu/Ti Lines from Strain Gradients Measured as a Function of Temperature Using Grazing Incidence X-Ray Scattering

Abstract

ABSTRACTStrain gradients in Al-0.5%Cu lines on a 1000Å Ti barrier layer have been measured during thermal cycling from room temperature to 400°C using X-rays from a Synchrotron Source in the Crazing Incidence Geometry. The stress gradient calculated from the strain gradient is shown at four temperatures during thermal cycling. The surface of the line is relaxed relative to the bulk during heating and more stressed during cooling. It was also found that the width direction of the line supports essentially no stress throughout the thermal cycle and that the much of the stress along the length of the line is relaxed during the first few minutes at elevated temperatures.