Microstructures and mechanical properties of Sn–8.55Zn–0.45Al–XAg solders

Abstract

The microstructure, melting point, and mechanical properties of Sn–8.55Zn–0.45Al–XAg lead-free solders were investigated. The Ag content of the solders investigated was 0–3 wt.%. The results indicate that the AgZn3 and Ag5Zn8 compounds are formed at the addition of Ag to Sn–8.55Zn–0.45Al solders. The adding of Ag also results in the formation of hypoeutectic structure, increasing the melting point of the solders and decreasing the ductility. Results of thermal analysis reveal that the Sn–8.55Zn–0.45Al–XAg solder has eutectic temperature at 198 °C when the addition of Ag is 0.5 wt.%. The eutectic solder exhibits greater tensile strength and higher ductility than the 63–Sn–37Pb solder.