Recrystallization of Si-, As- And BF2-Implanted, Bonded SOI

Abstract

ABSTRACTConventional and high-resolution cross-sectional TEM observations have been carried out on Si-, As- and BF2-implanted, bonded 100-nm-thick (001) SOI layers having polycrystalline Si (poly-Si) masks followed by annealing at 600°C. Amorphized SOI layers by these ion implantations are recrystallized through lateral solid-phase seeding epitaxy (L-SPE) by single crystal SOI under the poly-Si mask as a seed. The recrystallization of these SOI layers is completed in the order of BF2-, Si- and As-implanted layers by <110>-directed L-SPE, although the recrystallized layers have a high-density of {111}twins due to {111} facet formation at the growth front occurring during the first 30 s of annealing, independent of implanted ions. On the other hand, in the case of <100>-directed L-SPE, the growth of {110} faceted regions progresses after annealing for a few tens of minutes before folded {111} facets are formed, resulting in a good crystal quality region of 0.1∼0.2μm remaining, measured from the mask edge.