Author:
Többen D.,Weiganda P.,Shapiro M.J.,Cohen S.A.
Abstract
AbstractHydrogen silsesquioxane spin-on-glass (SOG) is regarded as a potential low-k material for multilevel metallization (MLM) schemes. In this work we report on the properties of films which have been cured at different temperatures covering the range from 350°C to 850°C. It is found that the material remains in its microporous structures at the lower temperature while it can be strongly densified at increased thermal budgets. The slope of the dielectric constant indicates that care ought to be taken in subsequent metallization anneals in order to preserve the low-k values observed.
Publisher
Springer Science and Business Media LLC
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