Abstract
ABSTRACTThis paper highlights a number of basic science issues related to wafer cleaning in silicon technology. Particle removal techniques, metal contamination, surface passivation, and integrated processing are used as key examples of areas of active research related to wafer cleaning. It is highlighted that wafer cleaning plays a far more significant role in device processing than just for contamination removal. However, even contamination removal faces formidable challenges such as the determination of safe contamination limits and the detection of trace amounts of contamination, all of which go well beyond the traditional realm of contamination control.
Publisher
Springer Science and Business Media LLC
Cited by
4 articles.
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