Decohesion of Thin Films From Ceramic Substrates

Abstract

ABSTRACTDecohesion of thin films from ceramic or semiconductor substrates is strongly influenced by internal stresses in films and stress concentrations from edges or flaws as well as by interfacial fracture energy. Residual stresses can cause spontaneous delamination, splitting and curling of films under tension or delamination, buckling and spal ling of films under residual compression, even with good interfacial bonding. Delamination behavior is considered using simple fracture mechanics models, supplemented with preliminary measurements of interfacial fracture energies. Formation conditions largely control internal stresses in films; whereas fracture energies are dictated by interfacial chemistry and mechanical factors such as plasticity.