A fracture model for exfoliation of thin silicon films
Author:
Funder
National Science Foundation
Publisher
Springer Science and Business Media LLC
Subject
Mechanics of Materials,Modeling and Simulation,Computational Mechanics
Link
http://link.springer.com/article/10.1007/s10704-019-00350-4/fulltext.html
Reference29 articles.
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2. Bedell SW, Shahrjerdi D, Hekmatshoar B, Fogel K, Lauro PA, Ott JA, Sosa N, Sadana D (2012) Kerf–Less removal of Si, Ge, and III–V layers by controlled spalling to enable low-cost PV technologies. IEEE J Photovolt 2(2):141–147. https://doi.org/10.1109/JPHOTOV.2012.2184267
3. Bedell SW, Fogel K, Lauro P, Shahrjerdi D, Ott JA, Sadana D (2013a) Layer transfer by controlled spalling. J Phys D Appl Phys 46(15):152002. https://doi.org/10.1088/0022-3727/46/15/152002
4. Bedell SW, Shahrjerdi D, Fogel K, Lauro P, Hekmatshoar B, Li N, Ott J, Sadana DK (2013b) (Invited) cost-effective layer transfer by controlled spalling technology. ECS Trans 50(7):315–323. https://doi.org/10.1149/05007.0315ecst
5. Bouchard PO, Bernacki M, Parks D (2013) Analysis of stress intensity factors and T-stress to control crack propagation for kerf-less spalling of single crystal silicon foils. Comput Mater Sci 69:243–250. https://doi.org/10.1016/j.commatsci.2012.10.033
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