Silicide formation in implanted channels and interfacial reactions of metal contacts under high current density

Abstract

Silicide formation in implanted channels and interfacial reactions of Ni, Co, Ti, and Cu contacts under high current density have been investigated. Silicide lines, forming in the implanted channels, were observed in Ni and Cu/p+–Si samples but not in Ti and Co samples. The silicide line formation is correlated to the high diffusivity of metals in Si. For the Ni/p+–Si sambles, silicode line was found to initiate form the cathode contact. Network structures at the cathode were found in both Co and Ni samples. The depth of silicide formation was found to extend to the junction depth. The relationships between the silicide length and contact size, the applied current, and the method of the applied current are discussed.