Substrate temperature: A critical parameter for the growth of microcrystalline silicon-carbon alloy thin films at low power

Abstract

P-type microcrystalline silicon-carbon alloy thin films have been prepared at low power by employing radio-frequency plasma-enhanced chemical vapor deposition (rf-PECVD) technique; judicious choice of deposition parameters is necessary. Substrate temperature has been observed to be the most critical parameter, while high hydrogen dilution is necessary but not a sufficient condition for obtaining crystallinity in silicon-carbon alloy thin films. Best microcrystallinity at moderate power density (78 mW/cm2) has been obtained at a fairly low substrate temperature (180 °C). The highest conductivity of 5.7 Scm−1 of a boron-doped microcrystalline sample could be achieved. Incorporation of carbon in these films has been confirmed from x-ray photoelectron spectroscopic (XPS) studies. Carbon is, however, incorporated only in the amorphous phase while the crystallites are of silicon only as observed from Raman spectra.