Local Cross-sectional Profiling of Multilayer Thin Films with an Atomic Force Microscope for Layer Thickness Determination-Reference-Cited by-同舟云学术

Local Cross-sectional Profiling of Multilayer Thin Films with an Atomic Force Microscope for Layer Thickness Determination

Published:1997-08 Issue:8 Volume:12 Page:1935-1938
ISSN:0884-2914
Container-title:Journal of Materials Research
language:en
Short-container-title:J. Mater. Res.

Author:

LaGraff J. R.,Murduck J. M.

Abstract

A new essentially nondestructive cross-sectional method is described for measuring the individual thicknesses of multilayer YBa2Cu3O7 (YBCO) and SrTiO3 (STO) thin films using off-axis ion milling and the atomic force microscope (AFM). Since the ion-milling is done during routine patterning of a thin-film device and the AFM requires only a small area for imaging, no additional sample preparation is required. This is a significant improvement over traditional cross-sectional techniques which often require lengthy and destructive sample preparation. Also, there is no a priori reason that this technique would not be amenable to other multilayer thin-film systems.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference15 articles.

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2. Optical thickness profiling using a semiconductor laser confocal microscope

3. 12. After stripping the photoresist and cleaning with an O2 plasma, the edge was noticeably rougher, thus making the layers more difficult to resolve.

4. 15. The STM, SEM, and TEM operate best with conductive or semiconductive samples which dissipate the electrons used in imaging. The AFM is a contact probe and only needs to be in physical contact with the surface to obtain an image, regardless of the electrical properties of the materials.

5. Epitaxial layer thickness measurement by cross‐sectional atomic force microscopy

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