X-Ray Observation of Stress Gradients and Precipitation in Passivated AL-0.5% Cu Films

Abstract

ABSTRACTGrazing incidence x-ray scattering has been used with a synchrotron source to characterize the stress gradients during thermal cycling in 1.0 μm thick Al-0.5%Cu films passivated with silicon nitride. The films were cycled between room temperature and 400°C. The stress-temperature behavior is quantitatively similar to that measured for unpassivated films. The presence of an inhomogeneous strain is documented at low temperatures. The dissolution and precipitation of Al2Cu is suggested as an explanation for the gradients and asymmetric x-ray peak broadening.