Thermal Stresses in Passivated Copper Interconnects Determined by X-Ray Analysis and Finite Element Modeling

Abstract

ABSTRACTStresses in passivated copper lines were determined from strains measured using x-ray methods and compared to stresses calculated using finite element methods. Copper lines, 2 µm wide by 0.8 µm thick, were fabricated by DC magnetron sputtering and lift off patterning. The cross section of these lines was trapezoidal, with approximately 50° sidewalls. One set of samples was left bare, the others passivated with Si3N4 in several different thicknesses. Strain was determined using x-rays. Stress was calculated using elastic moduli adjusted for predominantly (111) fiber texture. Elastic-plastic finite element models provided comparisons of the effects of passivation thickness, rectangular and trapezoidal cross section, and mechanical anisotropy due to preferred texture on the hydrostatic stress in a line. A similar model for aluminum also provided a comparison case of stress as a function of passivation thickness.