Author:
Oliver D.J.,Lawn B.R.,Cook R.F.,Reitsma M.G.,Bradby J.E.,Williams J.S.,Munroe P.
Abstract
Giant “pop-in” displacements are observed in crystalline silicon and germanium during high-load nanoindentation with a spherical diamond tip. These events are consistent with material removal triggered by lateral cracking during loading, which poses a hazard to microelectromechanical systems (MEMS) operation. We examine the scaling of the pop-in displacements as a function of peak indentation load and demonstrate a correlation with the depth of the plastic contact zone. We argue that giant pop-ins may occur in a broad range of highly brittle materials.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
34 articles.
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