Author:
Legresy J. M.,Blanpain B.,Mayer J. W.
Abstract
Solid-state amorphization is reported to occur in aluminum-platinum thin films. A uniform amorphous alloy layer was observed at the interface between aluminum and platinum layers for electron beam evaporated samples in an as-deposited state. For a pure aluminum overlayer deposited on top of a coevaporated Al–Pt amorphous alloy, the aluminum dissolves into the amorphous phase leading to a fully amorphous sample. In this last case the amorphization is nonuniform upon low-temperature anneals (T < ≃2 200 °C) and gives rise to hole formation in the aluminum overlayer. Direct observations of this phenomenon during in situ annealing of the thin films in a transmission electron microscope were carried out.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
20 articles.
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