Is the End-of-Range Loops Kinetics Affected by Surface Proximity or Ion Beam Recoils Distribution?

Author:

Ganin E.,Marwick A.

Abstract

AbstractWe studied formation and annihilation of dislocation loops formed beyond the amorphous/crystalline interface after indium and boron dual implantation and subsequent annealing in the 800–1 100°C temperature range. The residual damage for low (40 keV) and high (200 keV) energy In implants were compared. The depth of the amorphous region in the sample implanted with the higher energy ions was reduced by using anodic oxidation and etching, to equate it with that of the sample implanted by lower energy ions. This enabled the study of the effect of surface proximity on residual disorder upon annealing. The damage was strongly dependent on the energy of In ions. No end-of-range damage was observed for the low energy implant. High energy implantation resulted in end-of-range dislocation loops, stable below 1050°C. The loops kinetics was neither affected by their proximity to the surface, nor by In precipitation. Monte-Carlo full cascade simulation has been used to estimate the depth distribution of interstitials and vacancies produced by In implant.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Defects in Ultra-Shallow Junctions;Defects in Microelectronic Materials and Devices;2008-11-19

2. Using Quantitative TEM Analysis of Implant Damage to Study Surface Recombination Velocity in Silicon;MRS Proceedings;2006

3. Defect evolution of low energy, amorphizing germanium implants in silicon;Journal of Applied Physics;2003-03

4. Silicon: Defect Evolution;Encyclopedia of Materials: Science and Technology;2001

5. Ostwald ripening of end-of-range defects in silicon;Journal of Applied Physics;1998-03-15

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