Author:
Diawara Y.,Currie J.F.,Yelon A.,Petrova-Koch V.,Nikolov A.
Abstract
ABSTRACTThe mechanical stress induced in as-prepared porous silicon is generally compressive. Upon thermal annealing, the stress shows hysteresis. Isothermal annealing reveals second-order kinetic processes for both the stress and hydrogen effusion. The correlations between the changes in stress and porous silicon composition and structure are discussed.
Publisher
Springer Science and Business Media LLC
Cited by
5 articles.
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