Author:
Spearing S. M.,Tenhover M. A.,Lukco D. B.,Viswanathan L.,Hollen D. K.
Abstract
AbstractMetal/ceramic bilayers fracture by one of three failure modes; crazing, spalling or interfacial failure. Models for these failure modes are developed. The results are presented as maps that can be used in the design and failure analysis of electronic packages. Examples are presented for several material systems, including A1N.
Publisher
Springer Science and Business Media LLC
Cited by
3 articles.
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1. Solder Joint Technology;Handbook of Manufacturing Engineering and Technology;2014-09-30
2. Solder Joint Technology;Handbook of Manufacturing Engineering and Technology;2014
3. Edge delamination of residually stressed thin films: viscoelastic effects;International Journal of Fracture;1996-09