Interdiffusion At a-Ge:H/Al and a-Si:H/Al Interfaces

Abstract

The degree of interdiffusion at the amorphous semiconductor/bulk Al interface was studied using Auger electron spectroscopy analysis. 300-500 Å thick a-Si:H and a-Ge:H films were deposited onto high-purity Al and 5052 Al alloy substrates and subsequently annealed to various temperatures up to 500 °C for 6 hrs. The high-purity Al is used as a substrate for our small-angle x-ray scattering studies of amorphous silicon-based alloys. For all the films deposited on the pure Al, little or no interdiffusion was noted at or below anneal temperatures of 400°C. This result is contrary to those commonly found for samples produced by evaporating Al onto the previously deposited amorphous semiconductor without breaking the vacuum where interdiffusion has been noted at temperatures at or below 200°C. We suggest interdiffusion in the amorphous semiconductor/bulk Al samples is hindered by the presence of a 150-300 Å Al oxide on the Al. A large amount of interdiffusion and partial crystallization is noted in the a-Ge:H sample after an anneal of 450°C while a temperature between 450 and 500°C is required for interdiffusion and crystallization to occur in the a-Si:H sample. In the case of the a-Ge:H films deposited on the 5052 Al alloy, interdiffusion occurs after 300°C anneals due possibly to the migration of Mg and other components of the alloy into the amorphous semiconductors or structural defects in the alloy which enhance interdiffusion.