Author:
Wang Fang,Luo Xue-Mei,Wang Dong,Schaaf Peter,Zhang Guang-Ping
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference32 articles.
1. L.B. Freund, S. Suresh, Thin film materials: stress, defect formation and surface evolution, Cambridge University Press, (2004).
2. B. Comiskey, J.D. Albert, H. Yoshizawa, J. Jacobson, Nature. 394 253 (1998).
3. P. NP, G. M, J. EH, Science. (296), 280–284 (2002).
4. M. Ohring, Reliability and failure of electronic materials and devices, Academic Press, (1998).
5. Y.B. Park, R. Monig, C.A. Volkert, Thin Solid Films. 515 (6), 3253–3258 (2007).
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