Conductive Adhesives for Electronic Assemblies
Author:
Abstract
Publisher
Springer Science and Business Media LLC
Subject
Physical and Theoretical Chemistry,Condensed Matter Physics,General Materials Science
Reference16 articles.
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2. 14. Dunn D.J. , Vano P.P. , Moran J.P. Jr , Holmes M. , and Frauenglass E. , U.S. Patent No. 4,722,960 (February 2, 1988).
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