1. Improved dielectric and thermal properties of core-shell structured SiO2/polyolefin polymer composites for high-frequency copper clad laminates;Wu;Applied Surface Science,2021
2. Enhancing thermal conductivity of the insulating layer of high-frequency copper clad laminates via incorporating surface modified spherical hBN fillers;Ge;Journal of Materials Science: Materials in Electronics,2020
3. Surface modified and gradation-mixed Al2O3 as an effective filler for the polyphenylene oxide (PPO) insulative layer in copper clad laminates;Zhang;Journal of Materials Science: Materials in Electronics,2020
4. Effect and mechanism of the surface treatment and gradation filling of AlN on the performance of insulation layer of copper clad laminate;Lu;Journal of Inorganic Materials,2021
5. Effect of hexagonal boron nitride on the thermal and dielectric properties of polyphenylene ether resin for high-frequency copper clad laminates;Ge;Materials & Design,2019