Potential of the Ultra-thin Layer Fabricated by Wet-process as a Pore-seal for Porous Low-k Films

Abstract

AbstractWe succeeded in fabricating ultra-thin (<3 nm-thick) layer on top of the surface of porous low-k. The roughness of the surface of porous low-k remains homogeneous even after covering by the thin layer. Furthermore, we found that such ultra-thin layer suppresses the diffusion of metal into porous low-k film. Concerning adhesion property, the abrasion between the thin layer and copper was not detected after annealing at 350 deg C in forming gas. TVS measurement suggested that pH control of solution is the key to reduce damages of porous low-k and mobile ions. We believe that such ultra-thin layer, which we propose here, has a potential as a pore seal layer for porous low-k films.