Computer Simulations of Cluster-Solid Interactions: Energetic Clusters and Soft Landings

Author:

Ghaly Mai,Averback R. S.

Abstract

ABSTRACTThe interaction of small energetic clusters of Cu atoms with Cu surfaces has been investigated by molecular dynamics computer simulations. The simulations are fully dynamical and three dimensional; they employ embedded atom method potentials. The simulations described here are an extension of our past work on cluster solid interactions [1]. In this work, the effects of the angle of incidence, energy, size and temperature of the cluster are examined. In addition, soft landings of Cu clusters on Cu are simulated.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference2 articles.

1. 2. MOLDYCASK was developed at Harwell by Holian B. L. and Finnis M. W. .

2. Molecular-dynamics simulations of collisions between energetic clusters of atoms and metal substrates

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1. Cluster ion–solid interactions from meV to MeV energies;Applied Physics A;2008-04-24

2. Contact epitaxy in multiple cluster deposition;Applied Physics Letters;2006-12-18

3. Effect of binding energy and mass in cluster-induced sputtering of van-der-Waals bonded systems;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2005-01

4. Linearity and additivity in cluster-induced sputtering: A molecular-dynamics study of van der Waals bonded systems;Physical Review B;2004-10-13

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