Residual Stress and Microstructure of CU/W Multilayers

Abstract

ABSTRACTWe have determined residual stresses and the layer microstructure in as-prepared Cu/W multilayers of different periods ranging from 5.2 to 20 nm by both X-ray diffraction and the curvature radius method. The magnitude of the principal in-plane stress is large in the W layers (around - 6 GPa) and small in the Cu layers (-0.5 - + 0.5 GPa). The stress state is independent of the multilayer period. Under the compressive stress, the W cubic unit cell becomes monoclinic-like. The stress-free lattice parameter is found higher than the bulk one.We also studied the stress relaxation and the layer microstructure modification in W layers induced by Kr ion irradiation., the relaxation is almost achieved after only low fluence irradiations and the decrease of the stress-free lattice parameter in W layers observed for higher fluences is attributed to the formation of a sursaturated solid solution W(Cu).