Abstract
In this work, tungsten thin films were deposited on different substrates by magnetron sputtering and some of the films were then annealed at 1000°C for 1 hour in order to investigate the influence of different processing parameters on morphology and microstructure of films. Scanning electron microscope and x-ray diffraction were used to detect the morphology and microstructure of films. Under the same conditions, the thin films on different substrates showed different preferred grain orientations although the morphologies were similar. After thermal treatment, the morphology of films changed significantly and the total stress parallel to film surfaces dropped off sharply.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
1 articles.
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