Silicon Carbide Epitaxial Layers Grown ON SiC Wafers With Reduced Micropipe Density

Author:

Rendakova S.,Kuznetsov N.,Savkina N.,Rastegaeva M.,Andreev A.,Minbaeva M.,Morozov A.,Dmitriev V.

Abstract

ABSTRACTThe characteristics of SiC high-power devices are currently limited by the small area of the devices, which is usually less than 1 sq. mm. In order to increase device area, defect density in SiC epitaxial structures must be reduced. In this paper, we describe properties of silicon carbide epitaxial layers grown on 4H-SiC wafers with reduced micropipe density. These layers were grown by the vacuum sublimation method. Large area Schottky barriers (up to 8 mm2) were fabricated on SiC epitaxial layers and characterized.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference9 articles.

1. 7 Technologies and Devices International, Inc., Gaithersburg, MD 20877 (http://www.tdii.com.).

2. Overview of SiC power electronics

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