The Effect of Hydrogen Dilution on the Hot-Wire Deposition of Microcrystalline Silicon

Abstract

AbstractThe growth of amorphous (a-Si:H) and microcrystalline (pc-Si) silicon by hot-wire chemical vapor deposition (HWCVD) has been studied by combining in-situ ellipsometry, atomic force microscopy (AFM), and Raman spectroscopy. Generally a dense nucleation layer is formed during a-Si:H HWCVD, containing nuclei about 0.8 nm high and 10 to 20 nm in diameter. The surface roughness gradually increases with film thickness and settles at a root mean square (RMS) value of 1.6 nm at about 200 nm thickness. For hydrogen dilution at gas flow ratios x=[H2]/[SiH4] of 15 to 120 microcrystalline material was obtained. The grain size and nucleation layer, however, are strongly dependent on x. Low H2 dilution enhances the formation of an amorphous-like interface layer from which the μc-Si:H growth eventually starts. Increasing x promotes the etching of amorphous regions and the surface diffusion of precursors, resulting in larger nuclei. X = 30 yields extended μc-Si nuclei (30 nm height, 90 nm diameter) and a pronounced increase in surface roughness for thicker films, but suppresses the formation of the amorphous-like nucleation layer. A further increase in x remarkably lowers the growth rate, but smoother surfaces at comparable film thickness and larger lateral dimensions of the grains occur. This is interpreted as incipient etching of the crystallites.