Assessing failure in epitaxially encapsulated micro-scale sensors using micro and nano x-ray computed tomography-Reference-Cited by-同舟云学术

Assessing failure in epitaxially encapsulated micro-scale sensors using micro and nano x-ray computed tomography

Published:2018-04-12 Issue:2 Volume:8 Page:275-282
ISSN:2159-6859
Container-title:MRS Communications
language:en
Short-container-title:MRS Communications

Author:

Ortiz Lizmarie Comenencia,Heinz David B.,Flader Ian B.,Alter Anne L.,Shin Dongsuk D.,Chen Yunhan,Kenny Thomas W.,Thomas W. Kenny

Funder

Defense Advanced Research Projects Agency

National Science Foundation

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science

Link

http://link.springer.com/content/pdf/10.1557/mrc.2018.70.pdf

Reference29 articles.

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3. P.J. de Veen, C. Bos, D.R. Hoogstede, C.Th. A. Revenberg, J. Liljeholm, and T. Ebefors: High-resolution x-ray computed tomography of through silicon vias for RF MEMS integrated passive device applications. Microelectron. Reliab. 55, 1644 (2015).

4. C.A. Manier, K. Zoschke, H. Oppermann, D. Ruffieux, S. Dalla Piazza, T. Suni, J. Dekker, and G. Allegato: In Vacuum packaging at wafer level for MEMS using gold-tin metallurgy, European Microelectronics Packaging Conf, Grenoble, 2013; pp. 1–8.

5. Y. Wang: High-Resolution 3D Imaging and Material Analysis with Transmission X-Ray Microscopy and Nano-Ct: Characterization of Materials (John Wiley and Sons, Hoboken, 2012), pp. 1–10.

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