Author:
Hohl H.,Ramirez A. P.,Kaefer W.,Fess K.,Thurner Ch.,Kloc Ch.,Bucher E.
Abstract
AbstractTiNiSn, ZrNiSn and HfNiSn are members of a large group of intermetallic compounds which crystallize in the cubic MgAgAs-type structure. Polycrystalline samples of these compounds have been prepared and investigated for their thermoelectric properties. With thermopowers of about –200 μV/K and resistivities of a few mΩcm, power factors S2/ρ as high as 38 μW/K2 cm were obtained at 700 K. These remarkably high power factors are, however, accompanied by a thermal conductivity which is too high for applications. In order to reduce the parasitic lattice thermal conductivity, solid solutions Zrl−xHfxNiSn, Zrl−xTixNiSn, and Hfl−xTixNiSn were formed. The figure of merit of Zr0.5Hf0.5NiSn at 700 K (ZT = 0.41) exceeds the end members ZrNiSn (ZT = 0.26) and HfNiSn (ZT = 0.22).
Publisher
Springer Science and Business Media LLC
Cited by
60 articles.
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