A pathway to compound semiconductor additive manufacturing
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science
Link
http://link.springer.com/content/pdf/10.1557/mrc.2019.114.pdf
Reference21 articles.
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3. T.D. Ngo, A. Kashani, G. Imbalzano, K.T.Q. Nguyen, and D. Hui: Additive manufacturing (3D printing): a review of materials, methods, applications and challenges. Compos. Part B Eng. 143, 172–196 (2018).
4. E. Fortunato, P. Barquinha, and R. Martins: Oxide semiconductor thin-film transistors: a review of recent advances. Adv. Mater. 24, 2945–2986 (2012).
5. H. Morkoç, S. Strite, G.B. Gao, M.E. Lin, B. Sverdlov, and M. Burns: Large-band-gap SiC, III-V nitride, and II-VI ZnSe-based semiconductor device technologies. J. Appl. Phys. 76, 1363–1398 (1994).
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