Author:
Thornton R.P.,Elliman R.G.,Williams J.S.
Abstract
An amorphous-to-fine-grain-polycrystalline phase transformation has been observed during annealing of Sn-implanted Si when the peak Sn concentration exceeds about 2 at.%. At lower Sn concentrations, epitaxial growth is retarded in (100) Si but proceeds to completion with a large fraction of Sn residing on substitutional lattice sites. As the Sn concentration is increased, epitaxy is pre-empted by the sudden transformation of the near-surface Sn-doped region into polycrystalline Si. The time required to initiate the transformation is temperature dependent and is characterized by an activation energy of ∼1.7 eV. Rapid redistribution of Sn has been observed to accompany the transformation. Our observations are shown to be consistent with a melt-mediated crystallization process which is rate limited by Sn diffusion and precipitation in amorphous Si.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
22 articles.
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