Bottom Electrodes for High Dielectric Oxide Compounds: Effects on Crystallization of Lead Containing Ferroelectrics

Abstract

AbstractSeveral conductive structures, which appeared to be usable as base electrodes for integrated devices based on high dielectric materials, have been annealed for 30 minutes in oxygen at 650 °C. Similar structures coated with lead-based ferroelectrics deposited by the sol-gel method have been annealed for 1 min in oxygen at higher temperatures. The materials have been characterized by Rutherford backscattering (RBS) and scanning electron microscopy (SEM) and the crystallographic structure of the ferroelectrics films has been determined by X-ray diffractometry (XRD).Only RuO2/Ru has been found to be suitable as an electrode, at temperatures not exceeding 650 °C. It has also been found that the electrode materials can strongly affect the crystallization behavior of the sol-gel ferroelectric films and the formation of single-phase perovskite layers.