Author:
Rudawski N.G.,Jones K.S.,Gwilliam R.
Abstract
The solid-phase epitaxial growth kinetics of amorphized (011) Si with application of in-plane uniaxial stress to magnitude of 0.9 ± 0.1 GPa were studied. Tensile stresses did not appreciably change the growth velocity compared with the stress-free case, whereas compression tended to retard the growth velocity to approximately one-half the stress-free value. The results are explained using a prior generalized atomistic model of stressed solid-solid phase transformations. In conjunction with prior observations of stressed solid-phase epitaxial growth of (001) Si, it is advanced that the activation volume tensor associated with ledge migration may be substrate orientation-dependent.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Advances in ion beam modification of semiconductors;Current Opinion in Solid State and Materials Science;2015-02
2. Defective Solid-Phase Epitaxial Growth of Si;Semiconductors and Semimetals;2015
3. Interface stability in stressed solid-phase epitaxial growth;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2011-07
4. Atomistic considerations of stressed epitaxial growth from the solid phase;Scripta Materialia;2009-08
5. Stressed multidirectional solid-phase epitaxial growth of Si;Journal of Applied Physics;2009-04-15