Author:
Medelci N.,Tempez A.,Berishev I.,Starikov D.,Bensaoula A.
Abstract
ABSTRACTGallium nitride (GaN) has been under intense investigation due to its unique qualities (wide band gap, chemical and temperature stability) for optoelectronic and high temperature/high power applications. To this end, reactive ion etching (RIE) experiments were performed on GaN thin films using BCl3/Cl2/Ar. These resulted in etch rates of 1400 Å/min at −400 V dc bias. However, rough etched surfaces, nitrogen surface depletion and high chlorine content were observed. In order to remedy these shortcomings, a photo-assisted RIE process using a filtered Xe lamp beam was developed, resulting in higher etch rates but again in nitrogen depleted surfaces. Preliminary results on using nitrogen instead of argon in the process chemistry show a big improvement in photo-asssisted etch rates (50%) and Ga/N ratio (0.78 versus 1.25). In this paper, the effects of epilayer doping, dc bias, nitrogen flow rate and photo-irradiation flux on GaN etch rates, surface morphology and composition are presented. Finally, preliminary results on the use of a KrF excimer laser beam in the GaN photo-assisted RIE process are presented.
Publisher
Springer Science and Business Media LLC
Cited by
2 articles.
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