Platinum metallization on silicon and silicates
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://link.springer.com/content/pdf/10.1557/s43578-020-00084-3.pdf
Reference205 articles.
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3. J.V. Mantese and W.V. Alcini: Platinum wire wedge bonding: A new IC and microsensor interconnect. J. Electron. Mater. 17, 285–289 (1988).
4. J.E. Robinson, N.Y. Labrador, H. Chen, B.E. Sartor, and D.V. Esposito: Silicon oxide-encapsulated platinum thin films as highly active electrocatalysts for carbon monoxide and methanol oxidation. ACS Catal. 8, 11423–11434 (2018).
5. R. Zeiser, P. Wagner, and J. Wilde: Investigation of ultrasonic platinum and palladium wire bonding as interconnection technology for high-temperature SiC-MEMS. In 2012 4th Electronic System-Integration Technology Conference, 2012; pp. 1–6. doi:10.1109/ESTC.2012.6542125.
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