A 3-Dimensional Temperature Uniformity Model for a Rapid Thermal Processing Furnace

Abstract

ABSTRACTA fully three dimensional model has been developed for simulating the thermal behaviour of a RTP furnace. This model consists of two components to achieve the whole analysis. The first component models the radiation heat flux density at the wafer surface as a function of the system geometry, the lamp position and intensity, and the wall reflectivities. The second component solves the heat conduction equation at each point within the wafer using appropriate boundary conditions, including convective cooling which effect depends on the process conditions. A particular attempt is made upon the achievement of a flat temperature profile over the wafer by investigating the system parameters in order to improve the RTP equipement.