Determination of the Mechanical Properties OP Integrated Circuit Packaging Materials using a Focused Acoustic Beam Technique

Abstract

ABSTRACTA novel method for the measurement of the mechanical properties of integrated circuit interconnection and packaging materials using a conventional acoustic microscope lens, is presented in this paper. This technique allows the simultaneous generation and detection of longitudinal (LW) and shear (SH) acoustic waves in a material system based upon acoustic mode conversion principles at a water-solid interface. Experimental results obtained using a 50 MHz acoustic lens are presented for a range of ceramic materials and compared with published data. Acoustic ray propagation theory is employed to analyse the experimental results.