Experimental Determination of the Strain Transfer Across a Flexible Intermediate Layer in Thin Film Structures as a Function of Flexible Layer Thickness

Abstract

ABSTRACTThe tensile deformation behavior of nickel/ polyimide-thin-film / copper-thin-film structures is observed using anin situx-ray stress analysis technique. The x-ray stress is measured in the nickel and the copper simultaneously. From the analysis, the stress/strain transfer from the nickel through the polyimide to the copper can be measured.The effect of polyimide thickness (in the range from no polyimide to 33μm of polyimide) on the stress/strain transfer behavior is reported here.